Shanghai Alnchina New Materials Co., Ltd. is a a leading provider of microelectronic packaging and service .Alnchina is continuing to develop innovative semiconductor packaging solutions for high frequency RF, optoelectronics, as well as MEMS devices for both military and commercial applications. Our success is credited to our ongoing mission to provide high quality products and value while continuously working to improve our offerings so that they exceed our customer’s needs.
Alnchina offers:
a) HTCC Ceramic Package : CBGA, CQFN, CSMD and CSOP.
b) LCP Air Cavity Package : JEDEC compliant packages QFN,SOP and QFP....
c) Chip Testing Socket: QFN Socket, BGA Socket, and customized testing Socket.
After years of experience and accumulation, We are your trusted allies for designing and building your IC prototypes and production assembly projects in virtually package type. We look forward to working with you!
