CSOP
Ceramic Small Outline Package (CSOP) is a common surface-mount packaging type. Its leads extend from both sides, with pin pitches including 1.27mm, 1.00mm, 0.80mm, and 0.60mm, among others. It offers advantages such as low production cost, excellent performance, high reliability, compact size, light weight, and high packaging density, making it widely used in integrated circuit packaging.
An example diagram is provided below:
