Ceramic package||HTCC||Plastic package||Cavity package

With the advancement of communication technology, Monolithic Microwave Integrated Circuits (MMICs) are playing an increasingly critical role in high-tech fields such as electronic warfare, wireless networks, radar, satellite communications, and global positioning systems...

Plastic Cavity QFN Package with compatible ceramic lid, non-hermetic. Meets rapid packaging requirements for microwave communication and MEMS sensors...

Leveraging our comprehensive in-house resources and extensive portfolio of packaging solutions, we offer clients unique rapid chip packaging design services and consultancy, including our signature turnkey and lightning-fast packaging options...

Description of BGA1313-256balls Package Substrate
A. Overall dimensions: 13×13 mm, maximum allowable die size: 8×8 mm
B. Wire bonding (WB) connections on top side; BGA balls on bottom side for PCB interconnection
C. Pin-to-pad mapping available upon request