Complete Testing Solution for BGA256 Package

1. Description of BGA1313-256balls Package Substrate
A. Overall dimensions: 13×13 mm, maximum allowable die size: 8×8 mm
B. Wire bonding (WB) connections on top side; BGA balls on bottom side for PCB interconnection
C. Pin-to-pad mapping available upon request
D. Select pins with 50Ω impedance matching for RF/microwave port requirements

2. Description of Cavity Package Lid
A. Overall dimensions: 12.8×12.8 mm, cavity depth: 3 mm
B. LCP material, withstands temperatures up to 260°C
C. Recommended bonding method: epoxy adhesive to package substrate

3. Description of Test Fixture
A. Knob-operated latching mechanism
B. Retractable base design
C. Non-destructive to chips, reusable

4. Description of Test Board
A. Full 256-pin breakout
B. One-to-one correspondence with test socket and package substrate
C. Facilitates easy interconnection with other circuit boards

For further details, please contact us at 15801700368.