Plastic Air-Cavity Packaging Solution
Plastic Cavity QFN Package with compatible ceramic lid, non-hermetic. Meets rapid packaging requirements for microwave communication and MEMS sensors.
Shanghai Xintao Wei New Materials Co., Ltd. provides customers with rapid solutions for plastic cavity packages.
Plastic cavity packages are a product series designed to meet fast packaging needs. The primary difference compared to ceramic packages is that their hermeticity does not meet military standards. Their advantages include:
Model Variety: Different pin pitches and pin counts available to meet diverse customer requirements.
Short Production Cycle: Standard specifications and quantities can be delivered within one week, fulfilling urgent customer needs.
Excellent Quality: Semiconductor-grade materials, precision processing, and comprehensive product standards with quality assurance.
Standardization: JEDEC MO220 compliant.
Compatible Ceramic/Plastic Lids: Sealed to the package using adhesive sealing processes.
Basic Properties of LCP Material:
| 测试项目 | 典型数据 | 测试方法 | |
| 熔点 (Tm) ℃ | 350 | DSC | |
| 耐燃性 | VTM-0 | UL 94 | |
| 抗拉强度 MPa | >240 | IPC-TM-650, 2.4.19 | |
| 延伸率 % | >30 | IPC-TM-650, 2.4.19 | |
| 剥离强度 N/mm | 1 | IPC-TM-650 2.4.8 | |
| CTE (X/Y/Z) ppm/℃ | 16/16/17 | IPC-TM-650 2.4.24 | |
| 表面电阻 Ω | >1014 | IPC-TM-650, 2.5.17.1 | |
| 体积电阻率 Ω.cm | >1014 | IPC-TM-650, 2.5.17.1 | |
| 吸水率 % | 0.004 | IPC-TM-650, 2.5.6.2 | |
| 介电常数/Dk | 2.8~4.0 | IPC-TM-650-2.5.5.5 | |
| 介电损耗因子/Df | 0.002~0.003 | IPC-TM-650-2.5.5.5 | |
Advantages of LCP Packaging:
Good moisture resistance and near-military-standard hermeticity.
Excellent Dk/Df performance, suitable for microwave chip packaging.
Dimensional stability and high surface quality.
Ease of processing, meeting rapid packaging requirements.
Accepts customization of lead frames and package shells, with a typical lead time within two months.
For specific details, please contact us at 15801700368. Final specifications are subject to the official drawings.