Air Cavity QFN塑料封装管壳

QFN管壳

  • 品名: Air Cavity QFN塑料管壳
  • 来源: 国产自制
  • 周期: 4周以上
  • 定制: 接受定制

Air Cavity QFN Packages Open-molded Plastic Packages are pre-molded air cavity plastic QFN/SOIC packages designed to provide a convenient high-quality, high-performance solution for your prototype to full-production needs. Over 35 designs in multiple thicknesses, with a variety of pitch options and lead frame composition alternatives, are available immediately.


陶瓷封装管壳,陶瓷封装盖板lids,气密性封装管壳,Air Cavity QFN封装管壳



QFN3*3QFN6*6QFN9*9SOIC8SSOP16
QFN4*4QFN7*7QFN10*10SOIC16QFP10*10
QFN5*5QFN8*8QFN12*12SOIC24QFP12*12


Pre-Molded Air Cavity QFN Packages

• Quality suitable for production applications

 • Same-day availability on most options

• Performance realized into the Ka band

• Largest selection of 0.4mm pitch packages

• Production volumes • Mid-volume assembly services


 Custom QFN Plastic Packages

• I/O or paddle pattern packages with low NRE charge

• 3mm-square DFNs and other configurations

• Packages built to your spec or design for specific applications, i.e. simulating package designs with highfrequency transmission lines

 • Lead frame options for non-magnetic or low CTE applications

• Mold material options optimized for application


 QFN Package Air Cavity Lids

• Standard flat lids made from 91% alumina ceramic

 • Flat, RoHS- and REACH-compliant plastic lids

 • Lid with B-stage epoxy ring for sealed IC packages

 • Glass and quartz lids optional


,Air Cavity QFN Application

  • Microwave chip package

  • Millimeter Wave chip package

  • RF Applications 


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