Air Cavity QFN封装方案
Air Cavity QFN Packages Open-molded Plastic Packages are pre-molded air cavity plastic QFN/SOIC packages designed to provide a convenient high-quality, high-performance solution for your prototype to full-production needs. Over 35 designs in multiple thicknesses, with a variety of pitch options and lead frame composition alternatives, are available immediately.
Principal character
• 3x3 mm to 12x12 mm QFN package sizes
• Custom DFN/QFN body sizes and lead counts
• Ni/Au-plated lead frames standard; Ni/Pd/Au available
• Superior bondability
• Larger die-paddle area supports large die and ground bonds, per body size
• RoHS- and REACH-compliant “Green” molding compound
Pre-Molded Air Cavity QFN Packages
• Quality suitable for production applications
• Same-day availability on most options
• Performance realized into the Ka band
• Largest selection of 0.4mm pitch packages
• Production volumes • Mid-volume assembly services
Custom QFN Plastic Packages
• I/O or paddle pattern packages with low NRE charge
• 3mm-square DFNs and other configurations
• Packages built to your spec or design for specific applications,
• Lead frame options for non-magnetic or low CTE applications
• Mold material options optimized for application
QFN Package Air Cavity Lids
• Standard flat lids made from 91% alumina ceramic
• Flat, RoHS- and REACH-compliant plastic lids
• Lid with B-stage epoxy ring for sealed IC packages
• Glass and quartz lids optional
Air Cavity QFN Application
Microwave chip package
Millimeter Wave chip package
RF Applications